Samsung rushing fix for overheating Snapdragon 820
Samsung may be running into a few problems with the Galaxy S7 which is set to pack a Qualcomm Snapdragon 820 chip in the U.S and China.
Reports from BusinessKorea suggests the company is rushing a fix for overheating issues exhibited by the new design. Samsung is in hopes of releasing the Snapdragon 820 chip before the end of the month and is apparently having a patch to the overheating issue in the works. Failure to get the right patch to stop the issue which might lead Samsung to adding a radiating hub or pipe to cut down the excess heat generated by the chip as it appears Samsung might be running behind schedule on the release date of the Samsung Galaxy S7 device which is rumoured to arrive sometime around January, 2016.
However, Samsung’s interest in the chip is limited only to its smartphone as the chip manufacturers also provide the new 14nm FinFET technology used to produce these new chips.
The Qualcomm Snapdragon 820 chip promises faster processing and quicker charging and is expected to power the Samsung Galaxy S7 along with other new devices from LG, HTC, Xiaomi and other companies starting early next year.